The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Dec. 21, 2020
Applicant:

Korea Electronics Technology Institute, Seongnam-si, KR;

Inventor:

Soon Hyung Kwon, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/844 (2023.01);
U.S. Cl.
CPC ...
H10K 50/844 (2023.02);
Abstract

This application relates to a method for manufacturing a hybrid moisture barrier layer. In one aspect, the method includes preparing a base film and applying a photo-curable or heat-curable solution material to the base film, followed by photocuring or thermal curing to deposit at least one first moisture barrier layer. The method also includes depositing at least one second moisture barrier layer on the base film through atomic layer deposition (ALD), the second moisture layer being ⅓ to ½ the total thickness of the first moisture barrier. According to various embodiments, a combination of a moisture barrier layer formed by applying the photo-curable or heat-curable solution and a moisture barrier layer formed by atomic layer deposition at an effective thickness ratio brings about an effective reduction in production lead time as well as an improvement in the reliability of moisture barrier effect.


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