The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Jun. 23, 2021
Applicants:

Pioneer Corporation, Tokyo, JP;

Tohoku Pioneer Corporation, Tendo, JP;

Inventors:

Hirotsugi Hatakeyama, Yonezawa, JP;

Shinsuke Tanaka, Yonezawa, JP;

Shinji Nakajima, Yonezawa, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/84 (2023.01); H05B 33/04 (2006.01); H10K 50/805 (2023.01); H10K 50/842 (2023.01); H10K 77/10 (2023.01); H10K 71/20 (2023.01);
U.S. Cl.
CPC ...
H10K 50/841 (2023.02); H05B 33/04 (2013.01); H10K 50/805 (2023.02); H10K 50/8426 (2023.02); H10K 77/111 (2023.02); H10K 71/221 (2023.02);
Abstract

A light-emitting unit () is formed over a first surface () of a substrate (). A first terminal () and a second terminal () are formed on the first surface () of the substrate (), and are electrically connected to the light-emitting unit (). A sealing layer () is formed over the first surface () of the substrate (), and seals the light-emitting unit (). In addition, the sealing layer () does not cover the first terminal () and the second terminal (). A cover layer () is formed over the sealing layer (), and is formed of a material different from that of the cover layer (). In at least a portion of a region located next to the first terminal () and a region located next to the second terminal (), a portion of an end of the cover layer () protrudes from the sealing layer ().


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