The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Nov. 28, 2022
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventor:

Taehyeog Jung, Hwaseong-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 71/00 (2023.01); B32B 38/00 (2006.01); B32B 37/18 (2006.01); B32B 38/18 (2006.01); B32B 37/10 (2006.01); H10K 71/50 (2023.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
H10K 71/00 (2023.02); B32B 37/10 (2013.01); B32B 37/18 (2013.01); B32B 38/0012 (2013.01); B32B 38/1866 (2013.01); H10K 71/50 (2023.02); B32B 37/003 (2013.01); B32B 37/0046 (2013.01); B32B 2457/20 (2013.01); Y10T 156/1028 (2015.01);
Abstract

A bonding device includes: a stage and a pressing part, which is placed on the stage and is movable toward the stage. A first layer, which is disposed on an upper surface of the stage, includes a first flat portion and first bending portions. A second layer, which is disposed below a lower surface of the pressing part, includes a second flat portion and second bending portions. The first and second bending portions may be disposed between the stage and the pressing part, in a state bent with curvatures, respectively. The curvature of a lower surface of each of the second bending portions is smaller than the curvature of an upper surface of each of the first bending portions.


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