The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Mar. 29, 2021
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Yasser Khairat Soliman, Kanata, CA;

Hoang Mong Nguyen, Fountain Valley, CA (US);

Anthony James LoBianco, Irvine, CA (US);

Gregory Edward Babcock, Ottawa, CA;

Darren Roger Frenette, Pakenham, CA;

George Khoury, Ottawa, CA;

René Rodríguez, Rancho Santa Margarita, CA (US);

Leslie Paul Wallis, Ottawa, CA;

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H05B 47/19 (2020.01); H03F 3/24 (2006.01); H03F 1/32 (2006.01); H01L 23/552 (2006.01); H04B 1/40 (2015.01); H03F 3/195 (2006.01); H03F 1/22 (2006.01); H03F 1/34 (2006.01); H03F 1/56 (2006.01); H04B 1/04 (2006.01); F21V 23/00 (2015.01); H04W 84/12 (2009.01); H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01Q 9/42 (2006.01);
U.S. Cl.
CPC ...
H05B 47/19 (2020.01); F21V 23/006 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H03F 1/223 (2013.01); H03F 1/32 (2013.01); H03F 1/3205 (2013.01); H03F 1/347 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 3/245 (2013.01); H04B 1/0475 (2013.01); H04B 1/40 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/19104 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 9/42 (2013.01); H03F 2200/222 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01); H03F 2200/534 (2013.01); H04B 2001/0433 (2013.01); H04W 84/12 (2013.01);
Abstract

Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a multi-mode power amplifier circuit in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.


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