The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Aug. 14, 2020
Applicant:
Olympus Corporation, Tokyo, JP;
Inventor:
Toshiyuki Shimizu, Tokyo, JP;
Assignee:
OLYMPUS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/54 (2023.01); A61B 1/00 (2006.01); A61B 1/05 (2006.01); A61B 1/04 (2006.01); H04N 23/50 (2023.01);
U.S. Cl.
CPC ...
H04N 23/54 (2023.01); A61B 1/00124 (2013.01); A61B 1/04 (2013.01); A61B 1/051 (2013.01); H04N 23/50 (2023.01); H04N 23/555 (2023.01);
Abstract
An imaging unit includes: a semiconductor package including an imaging device and having a back surface on which a sensor electrode is formed; a circuit substrate including a connection electrode that is connected to the sensor electrode via a bump; a surrounding part configured to cover the semiconductor package and the circuit substrate; a filler with which a space that is enclosed by the surrounding part is filled to seal a circumference of the semiconductor package and the circuit substrate; and a first cover configured to prevent the filler from infiltrating a joint between the semiconductor package and the circuit substrate.