The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Feb. 09, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02326 (2021.01); H01S 5/02253 (2021.01); H01S 5/02212 (2021.01); H01S 5/0231 (2021.01); H01S 5/0239 (2021.01); H01S 5/024 (2006.01); H01S 5/02251 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02326 (2021.01); H01S 5/024 (2013.01); H01S 5/0231 (2021.01); H01S 5/0239 (2021.01); H01S 5/02212 (2013.01); H01S 5/02253 (2021.01); H01S 5/02251 (2021.01); H01S 5/02415 (2013.01); H01S 5/02469 (2013.01);
Abstract
An optical module includes: a stem including a first surface and a second surface opposite to the first surface; a thermoelectric cooler including a heat-releasing substrate fixed to the first surface; a semiconductor laser element attached to the thermoelectric cooler; a cap fixed to the first surface and covering the thermoelectric cooler and the semiconductor laser element; a lens fixed to the cap; and a restriction body fixed to the second surface. The linear thermal expansion coefficients of the heat-releasing substrate and the restriction body are smaller than the linear thermal expansion coefficient of the stem.