The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Jul. 28, 2021
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Ashish K. Sahoo, Santa Clara, CA (US);

Brandon Pierquet, San Francisco, CA (US);

Derryk C. Davis, Campbell, CA (US);

Javier Ruiz, San Jose, CA (US);

John M. Brock, San Carlos, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 29/20 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 23/14 (2013.01); H01L 23/31 (2013.01); H01L 23/36 (2013.01); H01L 23/5226 (2013.01); H01L 23/53228 (2013.01); H01L 27/088 (2013.01);
Abstract

Integrated power modules according to the present technology may include a printed circuit board characterized by a first surface and a second surface. The integrated power modules may include one or more surface-mounted components coupled with the first surface of the printed circuit board. The integrated power modules may include a heat-transfer substrate. The integrated power modules may include one or more gallium nitride transistors coupled between and soldered to each of the second surface of the printed circuit board and the heat-transfer substrate. The integrated power modules may include one or more spacers coupled between and soldered to each of the printed circuit board and the heat-transfer substrate.


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