The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Jul. 23, 2020
Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Ryo Kuwana, Tokyo, JP;

Masahiro Masunaga, Tokyo, JP;

Mutsumi Suzuki, Tokyo, JP;

Isao Hara, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2006.01); G01L 9/00 (2006.01); G21C 17/00 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 27/088 (2013.01); G01L 9/0042 (2013.01); G21C 17/00 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 29/1608 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1424 (2013.01);
Abstract

Provided is a SiC semiconductor element equipped with a SiC integrated circuit having a stable characteristic, which operates normally even in a radiation environment. A radiation resistant circuit device includes: a SiC semiconductor element equipped with a SiC integrated circuit, a printed board on which the SiC semiconductor element is provided, a conductive wiring that is arranged inside the printed board and has a predetermined surface facing a bottom surface of a substrate electrode of the SiC integrated circuit, and an insulating material arranged between the bottom surface of the substrate electrode of the SiC integrated circuit and the predetermined surface of the conductive wiring.


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