The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Jul. 28, 2021
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/40 (2006.01); H01L 23/42 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/49555 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/4012 (2013.01); H01L 23/42 (2013.01); H01L 23/49503 (2013.01); H01L 23/49562 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 25/16 (2013.01); H01L 2924/181 (2013.01);
Abstract
A molded semiconductor package includes a mold compound, a plurality of leads each having a first end embedded in the mold compound and a second end protruding from a side face of the mold compound, and a semiconductor die embedded in the mold compound and electrically connected, within the mold compound, to the plurality of leads. The second end of each lead of the plurality of leads has a bottom surface facing in a same direction as a bottom main surface of the mold compound. Each lead of the plurality of leads has a negative standoff relative to the bottom main surface of the mold compound.