The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Jul. 13, 2021
Applicants:
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Inventors:
Assignees:
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/492 (2006.01); H01L 23/00 (2006.01); H05K 3/10 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4924 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H05K 3/107 (2013.01); H05K 3/3468 (2013.01); H01L 2224/2612 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73251 (2013.01);
Abstract
A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.
Quick Actions:
Park, Jun. (2024). Soldering structure with groove portion and power module comprising the same (U.S. Patent No. 11862537). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11862537
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile