The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Aug. 19, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kiyki-Shiy Shang, Mountain House, CA (US);

Mikhail Taraboukhine, Pleasanton, CA (US);

Venkata Raghavaiah Chowdhary Kode, Pflugerville, TX (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); B25J 9/16 (2006.01); B25J 13/08 (2006.01); G01B 11/27 (2006.01); G01B 11/00 (2006.01); B25J 11/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); B25J 9/1694 (2013.01); B25J 11/0095 (2013.01); B25J 13/088 (2013.01); G01B 11/002 (2013.01); G01B 11/272 (2013.01); H01L 21/67259 (2013.01);
Abstract

Implementations disclosed describe an integrated sensor controller comprising a sensor circuit and a logic circuit. The sensor circuit includes a light source driver to generate a driving signal, a demultiplexer to produce, using the driving signal, a plurality of output driving signals to be delivered to one of a plurality of sensors, and an amplifier to: receive a first signal from a first sensor, the first signal being associated with a first event representative of a position of a substrate within a device manufacturing machine, and generate a second signal. The sensor circuit further includes an analog-to-digital converter to receive the second signal and generate a third signal. The logic circuit includes a memory device and a processing device coupled to the memory device, the processing device to obtain based on the third signal, information about the position of the substrate.


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