The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Dec. 15, 2022
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuta Kamo, Tokyo, JP;

Kenichi Kamehashi, Tokyo, JP;

Hisashi Tanaka, Tokyo, JP;

Isao Fujiwara, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/35 (2006.01); H01G 4/224 (2006.01); H01G 9/08 (2006.01); H01G 9/10 (2006.01);
U.S. Cl.
CPC ...
H01G 4/35 (2013.01); H01G 4/224 (2013.01); H01G 9/08 (2013.01); H01G 9/10 (2013.01);
Abstract

An element body is formed with a through hole to be open at a first main surface and a second main surface opposing each other. A through-conductor includes a first portion located inside the through hole and a second portion protruding from the second main surface. A case surrounds the element body and is electrically insulating. A cover surrounds the second portion and is electrically insulating. A first resin is contained in the case and coats the element body. A second resin is contained in the cover and is located in a space between an inner surface of the element body and the first portion. The second resin has an electrical resistivity less than an electrical resistivity of the first resin.


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