The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

May. 12, 2021
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Kyung Sik Kim, Suwon-si, KR;

Jong Hwan Lee, Suwon-si, KR;

Jeong Yun Park, Suwon-si, KR;

Tae Young Ham, Suwon-si, KR;

In Tae Seo, Suwon-si, KR;

Jae Sung Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01G 4/30 (2006.01); C04B 35/468 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1227 (2013.01); C04B 35/4682 (2013.01); H01G 4/30 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3236 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/442 (2013.01); C04B 2235/785 (2013.01);
Abstract

A multilayer electronic component according to some embodiments of the present disclosure includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer is 55% or more with respect to a total number of the dielectric grains included in the dielectric layer.


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