The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Aug. 11, 2021
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Byung Soo Kang, Suwon-si, KR;

Byeong Cheol Moon, Suwon-si, KR;

Joung Gul Ryu, Suwon-si, KR;

Ju Hwan Yang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01F 27/29 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01F 27/34 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 27/2804 (2013.01); H01F 27/327 (2013.01); H01F 27/346 (2013.01); H01F 41/041 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil component includes a body having a first surface and a second surface opposing each other in a thickness direction of the body and including a core formed in the thickness direction; a coil part embedded in the body and including at least one turn around the core; an insulating layer disposed on the first surface of the body; a bonded conductive layer disposed on the insulating layer and having a surface roughness of the first surface which is in contact with the insulating layer greater than a surface roughness of the second surface opposing the first surface of the bonded conductive layer; and external electrodes connected to the coil part and covering the bonded conductive layer.


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