The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Oct. 28, 2019
Applicant:

Maxell, Ltd., Kyoto, JP;

Inventors:

Eiji Kawawa, Kyoto, JP;

Toshinori Sugiyama, Kyoto, JP;

Tomoki Yamamoto, Kyoto, JP;

Tatsuya Nakazawa, Kyoto, JP;

Keisuke Sawada, Kyoto, JP;

Akio Misawa, Kyoto, JP;

Nozomu Shimoda, Kyoto, JP;

Assignee:

MAXELL, LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); G02B 27/01 (2006.01); H05K 7/20 (2006.01); B60K 35/00 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133385 (2013.01); G02B 27/0101 (2013.01); G02B 27/0149 (2013.01); H05K 7/20963 (2013.01); B60K 35/00 (2013.01); B60K 2370/1529 (2019.05); B60K 2370/166 (2019.05); B60K 2370/167 (2019.05); B60K 2370/23 (2019.05);
Abstract

A HUD includes a plate that connects an emission-surface of the LCD and a heat sink, is formed of a material having a higher thermal conductivity than air, and is provided with an emission-surface exhaust heat path that is formed to: include a holding region fixed to a periphery of the emission-surface directly or via a material having a higher thermal conductivity than air, and an intermediate region connecting the holding region and the heat sink; connect an end portion, which is opposite to the holding region, of the intermediate region with the heat sink directly or via a material having a higher thermal conductivity than air; extend from the emission-surface to the heat sink via the plate; and have a thermal gradient greater than that of a heat transfer path for transferring heat from the emission-surface to the heat sink by using air as a medium.


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