The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Nov. 19, 2021
Applicant:

Tyco Electronics (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Zhen Wang, Shanghai, CN;

Yiqun (Cham) Zhu, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 7/00 (2006.01); H01R 43/02 (2006.01); H02G 1/00 (2006.01);
U.S. Cl.
CPC ...
G01B 7/003 (2013.01);
Abstract

The present application provides a biasing device for detecting a conductor position and wire processing equipment. The biasing device has a bracket, a first drive mechanism, and a detection mechanism. The first drive mechanism has a first support shaft and a mounting slide block rotatably arranged on the bracket, and a mounting slide block, the mounting block can move relative to the bracket along the extension direction of the first support shaft when the first support shaft rotates; the detection mechanism is fixedly connected to the mounting slide block, and is arranged movably relative to the bracket along the extension direction of the first support shaft to determine whether the measured conductor is located in the detection area of the designated position. The biasing device provided by the present application compensates for the offset of the heat shrinkable tube by adversely adjusting the position of the detection mechanism in advance, thereby ensuring that the heat shrinkable tube is accurately wrapped on the exposed conductor surface at the designated position of the wire in the subsequent process and increasing the scope of application.


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