The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Jun. 01, 2021
Applicant:
Steven Schon, Stafford, PA (US);
Inventor:
Steven Schon, Stafford, PA (US);
Assignee:
QCIP Holdings, LLC, Strafford, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02S 40/44 (2014.01); F28D 15/04 (2006.01); F24S 10/95 (2018.01); F24S 23/74 (2018.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
F28D 15/043 (2013.01); F24S 10/95 (2018.05); F24S 23/74 (2018.05); H02S 40/44 (2014.12); F28D 2015/0225 (2013.01); Y02B 10/20 (2013.01); Y02B 10/70 (2013.01); Y02E 10/40 (2013.01); Y02E 10/46 (2013.01); Y02E 10/60 (2013.01);
Abstract
In one general aspect, a microelectronics cooling device can include a microchannel heat exchanger within an enclosure that houses the device at a heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at a heat sink end outside the enclosure. One or more pipes flowably connect the two ends for transporting liquid working fluid to the heat absorber and vaporized working fluid to the heat sink. The heat pipes may also be used to transfer heat outside a room that contains the electronic devices.