The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Mar. 23, 2022
Applicant:
Te Connectivity Solutions Gmbh, Schaffhausen, CH;
Inventors:
Lei Wang, San Jose, CA (US);
Martin W Bayes, Hopkinton, MA (US);
Ting Gao, Palo Alto, CA (US);
Kenneth Seufer, Kernersville, NC (US);
Philip Singer, Cary, NC (US);
James Zeigler, Harrisburg, PA (US);
Assignee:
TE CONNECTIVITY SOLUTIONS GMBH, Schaffhausen, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/34 (2014.01); B41M 5/00 (2006.01); C09D 11/03 (2014.01); C09D 11/12 (2006.01); C09D 11/38 (2014.01);
U.S. Cl.
CPC ...
C09D 11/34 (2013.01); B41M 5/0023 (2013.01); C09D 11/03 (2013.01); C09D 11/12 (2013.01); C09D 11/38 (2013.01);
Abstract
A printable non-curable thixotropic hot melt composition is described. The composition comprises non-curable holt melt waxes transformed into a thixotropic composition by the use of thickeners. The thickeners can be added separately to the hot melt wax or formed in-situ, either before or after application to the substrate. A process of forming such printable non-curable thixotropic hot melt composition is described.