The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

May. 09, 2022
Applicant:

Nan Ya Plastics Corporation, Taipei, TW;

Inventors:

Te-Chao Liao, Taipei, TW;

Hung-Yi Chang, Taipei, TW;

Chia-Lin Liu, Taipei, TW;

Chien-Kai Wei, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); B32B 15/06 (2006.01); B32B 15/08 (2006.01); C08L 9/06 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); B32B 15/06 (2013.01); B32B 15/08 (2013.01); C08L 9/06 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/1021 (2020.08); B32B 2305/076 (2013.01); B32B 2307/204 (2013.01); B32B 2457/04 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); C08L 2205/05 (2013.01); C08L 2207/324 (2013.01); C08L 2312/00 (2013.01); C08L 2666/72 (2013.01);
Abstract

A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.


Find Patent Forward Citations

Loading…