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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11858671 B1

PDFFull Text
Date of Patent:
Jan. 02, 2024

Filed:

Sep. 16, 2021

Pouch forming mold configuration, and method

Applicant:

Mespack Cloud, Llc, Des Plaines, IL (US);

Inventors:

Donn D. Hartman, Hawthorn Woods, IL (US);

Alexander J. Waterman, Mount Prospect, IL (US);

Michael Gregory Alcazar, Des Plaines, IL (US);

Anthony Crivolio, Elk Grove Village, IL (US);

Assignee:

Mespack Cloud, LLC, Des Plaines, IL (US);

Attorney:

Leydig, Voit & Mayer, Ltd.

Primary Examiner:

Joseph S Del Sole

Assistant Examiner:

Thu-Khanh T Nguyen

Int. Cl.
CPC ...
B29C 65/00 (2006.01); B65B 3/02 (2006.01); B65D 65/46 (2006.01); B65D 75/32 (2006.01); B29C 51/30 (2006.01); B65D 81/20 (2006.01); B65B 3/04 (2006.01); B65B 5/10 (2006.01); B65B 51/28 (2006.01); B29C 51/22 (2006.01); B29C 51/10 (2006.01); B29C 51/36 (2006.01); B29C 51/26 (2006.01); B29L 31/00 (2006.01); B29K 21/00 (2006.01); B65B 51/02 (2006.01); B65B 61/06 (2006.01);
U.S. Cl.
CPC ...
B65B 3/022 (2013.01); B29C 51/30 (2013.01); B65B 3/04 (2013.01); B65B 5/108 (2013.01); B65B 51/28 (2013.01); B65D 65/46 (2013.01); B65D 75/325 (2013.01); B65D 81/2061 (2013.01); B29C 51/10 (2013.01); B29C 51/225 (2013.01); B29C 51/266 (2013.01); B29C 51/36 (2013.01); B29C 2791/006 (2013.01); B29C 2793/009 (2013.01); B29K 2021/003 (2013.01); B29K 2831/04 (2013.01); B29K 2995/0062 (2013.01); B29L 2031/7128 (2013.01); B29L 2031/7174 (2013.01); B65B 51/02 (2013.01); B65B 61/06 (2013.01); B65D 75/327 (2013.01);
Abstract

A mold configuration for forming a pocket in a film comprising: a film support surface; a perimeter edge at said film support surface; wall surfaces inward of the perimeter edge defining a mold cavity; the wall surfaces including transition wall surfaces extending to a bottom wall surface; and a plateau surface inward of the perimeter edge. In one form, the perimeter edge includes sharp corner profile perimeter edge portions defining at least one sharp corner profile. A method of forming a pouch, includes using the disclosed mold configuration.

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