The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Feb. 10, 2020
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 70/68 (2006.01); H01B 13/00 (2006.01); B29L 31/34 (2006.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
B29C 70/683 (2013.01); H01B 13/0036 (2013.01); B29K 2063/00 (2013.01); B29L 2031/34 (2013.01);
Abstract
A method of manufacturing an electronic device in which an electronic component coupled to a lead is covered with a mold cover, includes: a coupling step of coupling the electronic component to the lead, a bending step of bending the lead to adjust a posture of the electronic component, and a molding step of molding the electronic component with a resin material to form the mold cover, and the bending step includes a lead bending step of bending the lead by pressing a pressing member against the lead without pressing the pressing member against the electronic component.