The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Oct. 13, 2021
City University of Hong Kong, Hong Kong, HK;
City University of Hong Kong, Hong Kong, HK;
Abstract
The present invention provides a method of in situ 4D printing of high-temperature materials including 3D printing a structure of an ink including a precursor. The structure is treated with controlled high energy flow to create a portion which has a different coefficient of thermal expansion/thermal shrinkage ratio. The structure is heated and the difference in the coefficient of thermal expansion creates an interface stress to cause a selected level of deformation. Alternatively, two structures with different coefficients of expansion/thermal shrinkage ratio may be printed. Thermal treatment of the two structures creates an interface stress to cause a selected level of deformation.