The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Jan. 13, 2023
Applicant:

Guangdong University of Technology, Guangzhou, CN;

Inventors:

Lijun Wei, Guangzhou, CN;

Shaowen Yao, Guangzhou, CN;

Qiang Liu, Guangzhou, CN;

Hao Zhang, Guangzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B26D 5/00 (2006.01); B26D 1/08 (2006.01);
U.S. Cl.
CPC ...
B26D 5/005 (2013.01); B26D 1/085 (2013.01);
Abstract

A cutting stock method for a rectangular sheet with defects includes: acquiring information of the rectangular defective sheet, including dimension information of the rectangular sheet and target blocks, and location information of the defects; acquiring a cutting position discrete set of the rectangular sheet; cutting the rectangular sheet according to the cutting position discrete set into a plurality of target blocks; calculating a sum of values of the target blocks, and selecting an optimal cutting solution with the largest sum of values; and cutting the rectangular sheet according to the optimal cutting solution.


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Wei, Lijun. (2024). System and method for cutting rectangular sheet stock with defects (U.S. Patent No. 11858159). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11858159

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