The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Dec. 20, 2019
Applicant:

Mega Fluid Systems, Inc., Tualatin, OR (US);

Inventors:

Robert Eiseler, Dundee, OR (US);

Koh Murai, Yamhill, OR (US);

Michael Perkins, II, Beaverton, OR (US);

Assignee:

Mega Fluid Systems, Inc., Tualatin, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 57/00 (2006.01); B24B 57/02 (2006.01); B01F 23/50 (2022.01); B01F 25/51 (2022.01); B01F 35/21 (2022.01); B01F 25/00 (2022.01); B01F 101/58 (2022.01);
U.S. Cl.
CPC ...
B24B 57/02 (2013.01); B01F 23/59 (2022.01); B01F 25/51 (2022.01); B01F 35/2113 (2022.01); B01F 35/21112 (2022.01); B01F 2025/931 (2022.01); B01F 2101/58 (2022.01);
Abstract

An apparatus for recirculating fluids in semiconductor systems. The apparatus including a base portion, an inlet portion coupled to a first end of the base portion, and a nozzle coupled to a second end of the base portion. The nozzle including a helical groove extending from a position near a nozzle base portion to a position near a tip of the nozzle portion. The helical groove extending from an exterior surface through the nozzle portion to an interior surface of the nozzle portion. Methods of using the apparatus in a semiconductor recirculation system are also disclosed.


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