The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Oct. 28, 2020
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Alexander Breymesser, Villach, AT;

Francisco Javier Santos Rodriguez, Villach, AT;

Klaus Sobe, Klagenfurt, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); G01R 31/52 (2020.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4038 (2013.01); G01R 31/52 (2020.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 1/165 (2013.01); H05K 3/0029 (2013.01); H05K 3/10 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/107 (2013.01);
Abstract

A method of forming a current measurement device includes providing a glass substrate having first and second substantially planar surfaces that are opposite one another, forming a plurality of through-vias in the glass substrate that each extend between the first and second substantially planar surfaces, and forming conductive tracks on the glass substrate that connect adjacent ones of the through-vias together. Forming the plurality of through-vias includes applying radiation to the glass substrate, and the conductive tracks and the through-vias collectively form a coil structure in the glass substrate.


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