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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11856694 B1

PDFFull Text
Date of Patent:
Dec. 26, 2023

Filed:

Aug. 31, 2020

Circuit substrate and method for manufacturing the same

Applicant:

National Taiwan University of Science and Technology, Taipei, TW;

Inventors:

Chen-Hao Wang, Taipei, TW;

Hsueh-Yu Chen, Taipei, TW;

Guan-Cheng Tong, Taipei, TW;

Assignee:

National Taiwan University of Science and Technology, Taipei, TW;

Attorney:

JCIPRNET

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/18 (2006.01); B29C 64/112 (2017.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); C23C 18/16 (2006.01); B29C 64/30 (2017.01); B33Y 40/20 (2020.01); H05K 3/46 (2006.01); B29K 67/00 (2006.01); B29K 101/12 (2006.01); B29K 105/00 (2006.01); B29L 31/34 (2006.01); B29K 55/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); B29C 64/112 (2017.08); B29C 64/30 (2017.08); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12); C23C 18/1607 (2013.01); C23C 18/1641 (2013.01); H05K 3/181 (2013.01); H05K 3/4644 (2013.01); B29K 2055/02 (2013.01); B29K 2067/046 (2013.01); B29K 2101/12 (2013.01); B29K 2105/0014 (2013.01); B29L 2031/3425 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0736 (2013.01);
Abstract

The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.

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