The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Jan. 26, 2022
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Yusuke Kamitsubo, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A resin multilayer substrate includes a stacked body provided by stacking and thermocompression bonding resin layers, a first conductor pattern inside the stacked body, and a first protective coating covering at least a first surface and a side surface of the first conductor pattern. The resin layers are made of a first thermoplastic resin, and the first protective coating is made of a second thermoplastic resin. Both of the first and second thermoplastic resins soften at a predetermined press temperature or less. The second thermoplastic resin has a storage modulus lower than a storage modulus of the first thermoplastic resin at a temperature equal to or less than the predetermined press temperature and equal to or more than room temperature.