The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Jul. 05, 2019
Applicant:
Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka, JP;
Inventor:
Masahiro Watanabe, Kizugawa, JP;
Assignee:
Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); C09J 7/29 (2018.01); C09J 7/38 (2018.01); B32B 7/12 (2006.01); B32B 27/06 (2006.01); B32B 27/28 (2006.01); C09J 9/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); B32B 7/12 (2013.01); B32B 27/06 (2013.01); B32B 27/281 (2013.01); C09J 7/29 (2018.01); C09J 7/38 (2018.01); C09J 9/02 (2013.01); H05K 3/4644 (2013.01); B32B 2255/10 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); C09J 2301/162 (2020.08); C09J 2463/00 (2013.01); C09J 2463/006 (2013.01); C09J 2467/006 (2013.01);
Abstract
An adhesive film for a printed wiring board includes an adhesive layerand an insulating protective layer. The insulating protective layer has an areal material ratio (Smr2) of 91% or less, the areal material ratio (Smr2) dividing reduced valleys from a core.