The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Dec. 06, 2021
Skyworks Solutions, Inc., Irvine, CA (US);
Zhiyang Liu, Dunstable, MA (US);
Nuttapong Srirattana, Billerica, MA (US);
Skyworks Solutions, Inc., Irvine, CA (US);
Abstract
A method for fabricating a semiconductor die is provided. The method can include providing a semiconductor substrate, forming a set of field-effect transistors on the semiconductor substrate, each field-effect transistor in the set of field-effect transistors having a respective source, drain, gate, and body, forming a compensation circuit on the semiconductor substrate, and connecting the compensation circuit to the set of field-effect transistors in parallel, the compensation circuit configured to compensate a non-linearity effect generated by the set of field-effect transistors.