The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Jun. 09, 2020
Applicant:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Inventors:

Shinichirou Wada, Tokyo, JP;

Tomohiko Yano, Tokyo, JP;

Yoichiro Kobayashi, Hitachinaka, JP;

Assignee:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42376 (2013.01); H01L 24/04 (2013.01); H01L 29/42356 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/04042 (2013.01);
Abstract

There is a problem that an area of a principal current cell is reduced by an area of a bonding pad wiring layer for a sub-cell. A source electrodeof a current detection cellis electrically connected to a bonding pad wiring layerformed on an interlayer insulating filmvia a wiring layer contact. The bonding pad wiring layeris formed with respect to a source electrodeof a principal current cellso as to cover a part of the source electrodevia the interlayer insulating film. As a result, the source electrodeis miniaturized, and a size of the source electrodeis made substantially equal to a size of the current detection cell. Therefore, the current detection celland the principal current cellare disposed close to each other.


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