The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Aug. 22, 2019
Applicant:
Karlsruher Institut Für Technologie, Karlsruhe, DE;
Inventors:
Uwe Bog, Karlsruhe, DE;
Michael Hirtz, Linkenheim-Hochstetten, DE;
Harald Fuchs, Münster, DE;
Jasmin Aghassi, Karlsruhe, DE;
Gabriel Cadilha Marques, Karlsruhe, DE;
Subho Dasgupta, Bangalore, IN;
Ben Breitung, Jockgrim, DE;
Horst Hahn, Seeheim-Jugendheim, DE;
Assignee:
Karlsruher Institut für Technologie, Karlsruhe, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G03F 7/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/76 (2013.01); G03F 7/0002 (2013.01); H01L 21/4853 (2013.01); H01L 23/49866 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/76152 (2013.01); H01L 2224/76611 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82102 (2013.01); H01L 2224/82805 (2013.01);
Abstract
The invention relates to a method () for producing an electrically conductive connection (′) on a substrate (), comprising the following steps: The invention furthermore relates to a method for producing a microelectronic device () and to a microelectronic device (), in particular a transistor ().