The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Nov. 24, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Jose Daniel Carlos Torres, Angeles, PH;
Ruby Ann Merto Camenforte, Mabalacat, PH;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/4825 (2013.01); H01L 21/563 (2013.01); H01L 23/3157 (2013.01); H01L 23/4952 (2013.01); H01L 23/562 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/73203 (2013.01); H01L 2924/35121 (2013.01);
Abstract
An article of manufacture comprises: an integrated circuit having a contact; a conductive bump electrically coupled to the contact, the conductive bump having a profile with a wave pattern; a lead frame electrically coupled to the conductive bump; and an integrated circuit package mold, the integrated circuit package mold covering portions of the conductive bump and the lead frame.