The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Mar. 28, 2022
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Naoki Il, Suwa, JP;
Yosuke Itasaka, Minowa, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/17 (2006.01); H03B 5/36 (2006.01); H03H 3/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H03B 5/36 (2013.01); H03H 3/02 (2013.01); H03H 9/0557 (2013.01); H03H 9/1021 (2013.01); H03H 9/178 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81206 (2013.01);
Abstract
The integrated circuit device includes: a pad that has a shape having a longitudinal direction and a lateral direction; a circuit that overlaps the pad in a plan view, and that is electrically coupled to the pad; a lead-out wiring that is led out from an outer edge on a longitudinal side of the pad along the lateral direction of the pad; and a via group that electrically couples the lead-out wiring and a wiring of the circuit and that does not overlap the pad in the plan view.