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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11854950 B1

PDFFull Text
Date of Patent:
Dec. 26, 2023

Filed:

Sep. 03, 2021

Semiconductor module and semiconductor device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Hideo Komo, Tokyo, JP;

Arata Iizuka, Tokyo, JP;

Takeshi Omaru, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Kenneth Parker

Assistant Examiner:

John undefined Lin

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/48 (2006.01); H01L 25/18 (2023.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49537 (2013.01); H01L 23/36 (2013.01); H01L 23/48 (2013.01); H01L 23/49548 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 24/32 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 23/3107 (2013.01); H01L 23/49562 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

The present invention is intended to provide a semiconductor module and a semiconductor device that are compatible with various rated currents. A semiconductor module includes a lead frame, and a semiconductor element joined with the lead frame. The lead frame includes a first joining structure and a second joining structure. The first joining structure includes a void part as a part at which the lead frame does not exist, and the second joining structure includes a void part as a part at which the lead frame does not exist. Each of the first joining structure and the second joining structure has a shape such that one of the first joining structure and the second joining structure complements at least part of the void part of the other assuming that the first joining structure and the second joining structure are overlapped.

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