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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11854937 B1

PDFFull Text
Date of Patent:
Dec. 26, 2023

Filed:

Dec. 07, 2020

Power module apparatus, cooling structure, and electric vehicle or hybrid electric vehicle

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Katsuhiko Yoshihara, Kyoto, JP;

Masao Saito, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 23/473 (2006.01); H02M 7/00 (2006.01); H05K 7/20 (2006.01); B60K 11/02 (2006.01); H01L 25/18 (2023.01); B60K 1/00 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); F28F 3/02 (2006.01); F28F 3/04 (2006.01); H01L 23/10 (2006.01); H01L 25/07 (2006.01); H01L 23/367 (2006.01); H02M 7/5387 (2007.01); H02M 1/32 (2007.01); B60K 6/22 (2007.10); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 29/16 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); B60K 1/00 (2013.01); B60K 11/02 (2013.01); F28F 3/022 (2013.01); F28F 3/04 (2013.01); H01L 23/10 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49555 (2013.01); H01L 23/49838 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01); H05K 7/209 (2013.01); H05K 7/2089 (2013.01); H05K 7/20927 (2013.01); B60K 6/22 (2013.01); B60K 2001/003 (2013.01); B60Y 2200/91 (2013.01); B60Y 2200/92 (2013.01); F28F 2230/00 (2013.01); H01L 23/3672 (2013.01); H01L 24/32 (2013.01); H01L 25/165 (2013.01); H01L 29/1608 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01); H01L 29/7804 (2013.01); H01L 29/7813 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14252 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H02M 1/327 (2021.05); H02M 7/5387 (2013.01); Y10S 903/904 (2013.01);
Abstract

A power module apparatus includes a power module having a package configured to seal a perimeter of a semiconductor device, and a heat radiator bonded to one surface of the package; a cooling device having a coolant passage through which coolant water flows, in which the heat radiator is attached to an opening provided on a way of the coolant passage, wherein the heat radiator of the power module is attached to the opening of the cooling device so that a height (ha) and a height (hb) are substantially identical to each other. The power module in which the heat radiator is attached to the opening formed at the upper surface portion of the cooling device can also be efficiently cooled, and thereby it becomes possible to reduce degradation due to overheating.

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