The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Jun. 21, 2021
Texas Instruments Incorporated, Dallas, TX (US);
Vivek Swaminathan Sridharan, Dallas, TX (US);
Christopher Daniel Manack, Flower Mound, TX (US);
Joseph Liu, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A semiconductor package includes a semiconductor substrate forming a cavity and a redistribution layer on a first side of the semiconductor substrate, the redistribution layer forming die contacts within the cavity and a set of terminals for the semiconductor package opposite the semiconductor substrate. The redistribution layer electrically connects one or more of the die contacts to the set of terminals. The semiconductor package further includes a semiconductor die including die terminals within the cavity with the die terminals electrically coupled to the die contacts within the cavity.