The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Jan. 15, 2021
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/66 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01L 23/24 (2006.01); H01L 21/48 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/4803 (2013.01); H01L 21/4817 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/66 (2013.01); H01Q 9/0407 (2013.01); H01L 2223/6677 (2013.01);
Abstract
A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.