The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Dec. 01, 2020
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Masataro Saito, Tokyo, JP;

Masazumi Arata, Tokyo, JP;

Hokuto Eda, Tokyo, JP;

Kohei Takahashi, Tokyo, JP;

Takamasa Iwasaki, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/323 (2013.01); H01F 2027/2809 (2013.01);
Abstract

In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.


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