The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Sep. 15, 2020
Applicant:

Lanzhou University, Gansu, CN;

Inventors:

Xingyi Zhang, Lanzhou, CN;

Baoqiang Zhang, Anzhou, CN;

Qiangqiang Zhang, Lanzhou, CN;

Cong Liu, Lanzhou, CN;

Huadong Yong, Lanzhou, CN;

Youhe Zhou, Lanzhou, CN;

Assignee:

LANZHOU UNIVERSITY, Lanzhou, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 40/10 (2020.01); B28B 1/00 (2006.01); B28B 11/24 (2006.01); H01B 12/02 (2006.01); C01G 3/00 (2006.01);
U.S. Cl.
CPC ...
H01B 12/02 (2013.01); B28B 1/001 (2013.01); B28B 11/243 (2013.01); B33Y 10/00 (2014.12); B33Y 40/10 (2020.01); B33Y 40/20 (2020.01); C01G 3/006 (2013.01); C01P 2006/40 (2013.01);
Abstract

The present disclosure relates to a method for preparing high-temperature superconducting yttrium barium copper oxide (YBCO) wire by 3D-printing, this method is divided into the following four steps: firstly, preparing a nano-level superconducting powder precursor; and then, preparing a printing paste with suitable viscosity and supporting characteristics; after that, using a CAD 3D modeling, exporting STL format model data and slicing by a professional software; implementing one-step preparing strands with low AC loss by twisting the print nozzle. Finally, the printed twisted wire is formed into a practical superconducting twisted cable through the processes such as plastic removal process, crystallizing process, oxygen supplementing process and assembling process in order. The present disclosure firstly provides an application for applying high temperature superconducting material to direct ink writing 3D-printing technology. By preparing micro/nano level superconducting core filaments based on 3D-printing, the diameter of the core filaments could be reduced, and thereby a material-structure integrative design could be implemented. The present disclosure simplifies the preparation of high temperature superconducting wires, improves the current-carrying capacity and the production efficiency of the high temperature super conducting wires, and reduces the production cost.


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