The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Apr. 15, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyunjoong Kim, Seoul, KR;

Jaepil Shin, Suwon-si, KR;

Moonhyun Cha, Yongin-si, KR;

Changwook Jeong, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); G06F 30/39 (2020.01); G06F 30/27 (2020.01); G06N 3/08 (2023.01); G06N 3/045 (2023.01); G06F 119/02 (2020.01); G06F 119/18 (2020.01);
U.S. Cl.
CPC ...
G06F 30/27 (2020.01); G06N 3/045 (2023.01); G06N 3/08 (2013.01); G06F 2119/02 (2020.01); G06F 2119/18 (2020.01);
Abstract

A system for modeling a semiconductor fabrication process includes at least one first processor and at least one second processor. The at least one first processor is configured to provide at least one machine learning (ML) model, which is trained by using a plurality of pairs of images of a design pattern sample and a physical pattern sample. The physical pattern sample is formed from the design pattern sample by using the semiconductor fabrication process. The at least one second processor is configured to provide an input image representing a shape of a design pattern and/or a physical pattern to the at least one first processor and to generate output data defining the physical pattern and/or the design pattern based on an output image received from the at least one first processor.


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