The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Feb. 17, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Garrett Ho-Yee Sin, Sunnyvale, CA (US);

Sidharth Bhatia, Santa Cruz, CA (US);

Katty Marie Lydia Gamon Guyomard, Los Altos, CA (US);

Shawyon Jafari, Sunnyvale, CA (US);

Heng-Cheng Pai, Cupertino, CA (US);

Pramod Nambiar, Sunnyvale, CA (US);

Paul Lukas Brillhart, Pleasanton, CA (US);

Ilker Durukan, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); G06N 20/00 (2019.01); G01N 33/00 (2006.01); G06F 30/398 (2020.01); G06F 119/22 (2020.01); G06F 119/18 (2020.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); G01N 33/00 (2013.01); G06F 30/398 (2020.01); G06N 20/00 (2019.01); G01N 2033/0095 (2013.01); G05B 2219/31264 (2013.01); G05B 2219/32179 (2013.01); G05B 2219/45031 (2013.01); G06F 2119/18 (2020.01); G06F 2119/22 (2020.01);
Abstract

A method includes receiving part data associated with a corresponding part of substrate processing equipment, sensor data associated with one or more corresponding substrate processing operations performed by the substrate processing equipment to produce one or more corresponding substrates, and metrology data associated with the one or more corresponding substrates produced by the one or more corresponding substrate processing operations performed by the substrate processing equipment that includes the corresponding part. The method further includes generating sets of aggregated part-sensor-metrology data including a corresponding set of part data, a corresponding set of sensor data, and a corresponding set of metrology data. The method further includes causing analysis of the sets of aggregated part-sensor-metrology data to generate one or more outputs to perform a corrective action associated with the corresponding part of the substrate processing equipment.


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