The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Mar. 22, 2018
Multidimension Technology Co., Ltd., Zhangjiagang, CN;
James Geza Deak, Zhangjiagang, CN;
Elamparithi Visvanathan, Zhangjiagang, CN;
MultiDimension Technology Co., Ltd., Zhangjiagang, CN;
Abstract
A magnetic sensor packaging structure with a hysteresis coil comprising a substrate, a sensor chip, a spiral hysteresis coil on the substrate, and wire bonding pads. The sensor bridge arms are composed of magnetoresistive sensing elements. The sensor bridge arms are deposited on the sensor chip, and the sensor bridge arms are electrically interconnected to form a magnetoresistive sensor bridge that is located on the hysteresis coil. The magnetic field generated by the spiral hysteresis coil is collinear with a sensitive axis of the sensor bridge. The magnetoresistive sensor bridge is located on the substrate and encapsulated. By placing the spiral hysteresis coil on the substrate, it is capable of supporting larger currents with smaller resistance value. This allows the sensor hysteresis to be effectively eliminated. In addition, the packaging structure manufacturing process is simple and cost effective.