The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Sep. 30, 2020
Applicant:

Point Engineering Co., Ltd., Asan, KR;

Inventors:

Bum Mo Ahn, Suwon, KR;

Seung Ho Park, Hwaseong, KR;

Sung Hyun Byun, Hwaseong, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07342 (2013.01); H05K 1/0298 (2013.01); H05K 3/107 (2013.01); H05K 3/462 (2013.01);
Abstract

Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.


Find Patent Forward Citations

Ahn, Bum. (2023). Multilayer wiring substrate, method of manufacturing same, and probe card having same (U.S. Patent No. 11852655). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11852655

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…