The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Feb. 21, 2022
Corning Incorporated, Corning, NY (US);
Ryan Claude Andrews, Elmira, NY (US);
David Matthew Berg, Rochester, NY (US);
Pierre Michel Bouzi, Horseheads, NY (US);
William John Furnas, Elmira, NY (US);
Jacob Immerman, Corning, NY (US);
Jeremiah Robert Jacobson, Corning, NY (US);
Katherine Anne Lindberg, Corning, NY (US);
Glenn Abram Newcomer, Pine City, NY (US);
Evan Lewis Olson, Elmira, NY (US);
Viktor Stepanov, Painted Post, NY (US);
Nathaniel David Wetmore, Corning, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
The hybrid measurement system includes an evanescent prism coupling spectroscopy (EPCS) sub-system and a light-scattering polarimetry (LSP) sub-system. The EPCS sub-system includes an EPCS light source system optically coupled to an EPCS detector system through an EPCS coupling prism. The LSP sub-system includes an LSP light source optically coupled to an optical compensator, which in turn is optically coupled to a LSP detector system via a LSP coupling prism. A support structure supports the EPCS and LSP coupling prisms to define a coupling prism assembly, which supports the two prisms at a measurement location. Stress measurements made using the EPCS and LSP sub-systems are combined to fully characterize the stress properties of a transparent chemically strengthened substrate. Methods of processing the EPCS and LSP measurements and enhanced configurations of the EPCS and LPS sub-systems to improve measurement accuracy are also disclosed.