The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Jun. 23, 2017
Applicant:
General Electric Company, Schenectady, NY (US);
Inventor:
Scott Alan Gold, Waynesville, OH (US);
Assignee:
General Electric Company, Schenectady, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/04 (2006.01); C23C 16/50 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B28B 1/00 (2006.01); B33Y 40/00 (2020.01); C23C 16/04 (2006.01); C23C 16/52 (2006.01); B23K 15/00 (2006.01); B23K 26/342 (2014.01); B23K 26/082 (2014.01); B29C 64/153 (2017.01); B22F 7/06 (2006.01); B29C 64/165 (2017.01); B29C 64/20 (2017.01); B22F 7/02 (2006.01); B33Y 40/20 (2020.01); B22F 10/14 (2021.01); B22F 10/28 (2021.01); B22F 12/49 (2021.01); B22F 12/67 (2021.01); B22F 12/70 (2021.01); B22F 10/50 (2021.01); B22F 10/62 (2021.01); B22F 3/24 (2006.01); B22F 12/00 (2021.01); B22F 10/36 (2021.01); B22F 10/64 (2021.01);
U.S. Cl.
CPC ...
C23C 16/50 (2013.01); B22F 7/02 (2013.01); B22F 7/04 (2013.01); B22F 7/06 (2013.01); B22F 10/14 (2021.01); B22F 10/28 (2021.01); B22F 10/50 (2021.01); B22F 10/62 (2021.01); B22F 12/49 (2021.01); B22F 12/67 (2021.01); B22F 12/70 (2021.01); B23K 15/0086 (2013.01); B23K 26/082 (2015.10); B23K 26/342 (2015.10); B28B 1/001 (2013.01); B29C 64/153 (2017.08); B29C 64/165 (2017.08); B29C 64/20 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 40/20 (2020.01); C23C 16/04 (2013.01); C23C 16/52 (2013.01); B22F 3/24 (2013.01); B22F 10/36 (2021.01); B22F 10/64 (2021.01); B22F 12/224 (2021.01); B22F 2003/242 (2013.01); B22F 2999/00 (2013.01);
Abstract
The present disclosure generally relates to methods and apparatuses for chemical vapor deposition (CVD) during additive manufacturing (AM) processes. Such methods and apparatuses can be used to embed chemical signatures into manufactured objects, and such embedded chemical signatures may find use in anti-counterfeiting operations and in manufacture of objects with multiple materials.