logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11851603 B1

PDFFull Text
Date of Patent:
Dec. 26, 2023

Filed:

Nov. 07, 2018

Thermally conductive composition and methods and devices in which said composition is used

Applicants:

Dow Global Technologies Llc, Midland, MI (US);

Dow Silicones Corporation, Midland, MI (US);

Inventors:

Xiaolian Hu, Shanghai, CN;

Jiguang Zhang, Shanghai, CN;

Yan Zheng, Shanghai, CN;

Hongyu Chen, Shanghai, CN;

Chen Chen, Shanghai, CN;

Dorab Bhagwagar, Saginaw, MI (US);

Darren Hansen, Auburn, MI (US);

Assignees:

DOW SILICONES CORPORATION, Midland, MI (US);

DOW GLOBAL TECHNOLOGIES LLC (DGTL), Midland, MI (US);

Attorney:

Steven Mork

Primary Examiner:

Nelson J Nieves

Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08G 77/20 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/38 (2006.01); C08K 5/3417 (2006.01); C08K 7/18 (2006.01); C08K 13/04 (2006.01); F28F 23/00 (2006.01); C08G 77/00 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08G 77/20 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/38 (2013.01); C08K 5/3417 (2013.01); C08K 7/18 (2013.01); C08K 13/04 (2013.01); F28F 23/00 (2013.01); C08G 77/80 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 2003/282 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/014 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01);
Abstract

A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.

Find Patent Forward Citations

Loading…