The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Oct. 30, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Uma Sridhar, Sunnyvale, CA (US);

Sivapackia Ganapathiappan, Los Altos, CA (US);

Ashwin Chockalingam, Santa Clara, CA (US);

Yingdong Luo, San Jose, CA (US);

Daniel Redfield, Morgan Hill, CA (US);

Rajeev Bajaj, Fremont, CA (US);

Nag B. Patibandla, Pleasanton, CA (US);

Hou T. Ng, Campbell, CA (US);

Sudhakar Madhusoodhanan, Pleasanton, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/112 (2017.01); C09D 11/38 (2014.01); B24B 37/24 (2012.01); C09D 11/107 (2014.01); C09D 11/101 (2014.01); B33Y 80/00 (2015.01); B33Y 70/00 (2020.01); B29L 31/00 (2006.01); B29K 33/00 (2006.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
C09D 11/38 (2013.01); B24B 37/245 (2013.01); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C09D 11/101 (2013.01); C09D 11/107 (2013.01); B29C 64/112 (2017.08); B29K 2033/08 (2013.01); B29L 2031/736 (2013.01); B33Y 10/00 (2014.12);
Abstract

Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.


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