The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Jan. 29, 2020
Lpkf Laser & Electronics Ag, Garbsen, DE;
Robin Krüger, Hannover, DE;
Roman Ostholt, Langenhagen, DE;
Norbert Ambrosius, Garbsen, DE;
Oktavia Ostermann, Hannover, DE;
Bernd Rösener, Porta Westfalica, DE;
Daniel Dunker, Hannover, DE;
Arne Schnoor, Hannover, DE;
Malte Schulz-Ruhtenberg, Wunstorf, DE;
LPKF LASER & ELECTRONICS AG, Garbsen, DE;
Abstract
The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.