The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Dec. 26, 2019
Applicant:

Jfe Steel Corporation, Tokyo, JP;

Inventors:

Katsutoshi Takashima, Tokyo, JP;

Minoru Tanaka, Tokyo, JP;

Kenji Tsuzumi, Tokyo, JP;

Shingo Arakawa, Tokyo, JP;

Michitaka Sakurai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C21D 6/00 (2006.01); B32B 15/01 (2006.01); B21B 3/02 (2006.01); C21D 8/02 (2006.01); C21D 9/46 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/08 (2006.01); C22C 38/16 (2006.01); C22C 38/26 (2006.01); C22C 38/28 (2006.01); C22C 38/32 (2006.01); C23C 2/02 (2006.01); C23C 2/26 (2006.01); C23C 2/28 (2006.01); C25D 3/22 (2006.01);
U.S. Cl.
CPC ...
B32B 15/015 (2013.01); B21B 3/02 (2013.01); C21D 6/001 (2013.01); C21D 6/002 (2013.01); C21D 6/005 (2013.01); C21D 6/008 (2013.01); C21D 8/0205 (2013.01); C21D 8/0226 (2013.01); C21D 8/0236 (2013.01); C21D 8/0263 (2013.01); C21D 9/46 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/08 (2013.01); C22C 38/16 (2013.01); C22C 38/26 (2013.01); C22C 38/28 (2013.01); C22C 38/32 (2013.01); C23C 2/02 (2013.01); C23C 2/024 (2022.08); C23C 2/0224 (2022.08); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C21D 2211/008 (2013.01); C25D 3/22 (2013.01);
Abstract

A hot-pressed member has a predetermined chemical composition. In the hot-pressed member, a steel sheet has a microstructure in which a prior austenite average grain diameter is 8 μm or less, and martensite is present in a volume fraction of 95% or greater in a region within 30 μm of a surface; a Ni diffusion region having a thickness of 0.5 μm or greater exists in a surface layer; a standard deviation of Vickers hardness values is 35 or less; Mndif (mass %) in a sheet thickness direction ≤0.20, where Mndif (mass %) is a degree of Mn segregation; and a tensile strength is 1780 MPa or greater.


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