The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Jan. 31, 2020
Applicant:

Nissei Asb Machine Co., Ltd., Nagano, JP;

Inventors:

Yoichi Tsuchiya, Nagano, JP;

Manabu Ogihara, Nagano, JP;

Atsushi Nagasaki, Nagano, JP;

Kazuhiro Horiuchi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 49/06 (2006.01); B29C 49/64 (2006.01); B29C 49/28 (2006.01); B29K 67/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 49/6427 (2013.01); B29C 49/06 (2013.01); B29C 49/28 (2013.01); B29K 2067/003 (2013.01); B29L 2031/7158 (2013.01);
Abstract

In a manufacturing apparatus for manufacturing a resin container which includes an injection molding part configured to injection-mold a preform, a temperature adjustment part configured to adjust a temperature of the preform molded in the injection molding part, and a blow molding part configured to blow-mold the preform whose temperature has been adjusted in the temperature adjustment part, the preform is carried into the temperature adjustment part before an outer surface temperature of the preform molded in the injection molding part becomes higher than an inner surface temperature of the preform molded in the injection molding part, and the preform is cooled to be lowered within a range equal to or higher than 10° C. and equal to or lower than 50° C. in the temperature adjustment part.


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